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NLAS1053 2:1 Mux/Demux Analog Switches
The NLAS1053 is an advanced CMOS analog switch fabricated with silicon gate CMOS technology. It achieves very high speed propagation delays and low ON resistances while maintaining CMOS low power dissipation. The device consists of a single 2:1 Mux/Demux (SPDT), similar to ON Semiconductor's NLAS4053 analog and digital voltages that may vary across the full power supply range (from VCC to GND). The inhibit and select input pins have over voltage protection that allows voltages above VCC up to 7.0 V to be present without damage or disruption of operation of the part, regardless of the operating voltage.
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* * * * * * * * * *
High Speed: tPD = 1 ns (Typ) at VCC = 5.0 V Low Power Dissipation: ICC = 2 A (Max) at TA = 25C High Bandwidth, Improved Linearity, and Low RDSON INH Pin Allows a Both Channels `OFF' Condition (With a High) RDSON 25 , Performance Very Similar to the NLAS4053 Break Before Make Circuitry, Prevents Inadvertent Shorts Useful For Switching Video Frequencies Beyond 50 MHz Latch-Up Performance Exceeds 300 mA ESD Performance: HBM > 2000 V; MM > 200 V, CDM > 1500 V Tiny US8 Package, Only 2.1 X 3.0 mm
US8 US SUFFIX CASE 493-01
AC
1
D
AC D
= Device Code = Date Code
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet.
COM 1 INH 2 N/C 3 GND 4
8 7 6 5
VCC CH0 CH1 Select INH H L L
FUNCTION TABLE
Select X L H Ch 0 OFF ON OFF Ch 1 OFF OFF ON
Figure 1. Pin Assignment
(c) Semiconductor Components Industries, LLC, 2002
1
February, 2002 - Rev. 0
Publication Order Number: NLAS1053/D
NLAS1053
MAXIMUM RATINGS
Symbol VCC VIN VIS IIK TSTG TL TJ qJA PD MSL FR VESD Positive DC Supply Voltage Digital Input Voltage (Select and Inhibit) Analog Output Voltage (VCH or VCOM) DC Current, Into or Out of Any Pin Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds Junction Temperature under Bias Thermal Resistance Power Dissipation in Still Air at 85_C Moisture Sensitivity Flammability Rating ESD Withstand Voltage Oxygen Index: 30% - 35% Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Parameter Value -0.5 to +7.0 -0.5 V is +7.0 -0.5 V is VCC +0.5 50 -65 to +150 260 +150 250 250 Level 1 UL-94-VO (0.125 in) > 2000 200 N/A V Unit V V V mA _C _C _C _C/W mW
ILatch-Up Latch-Up Performance Above VCC and Below GND at 85_C (Note 5) 300 mA Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute-maximum-rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2-ounce copper trace with no air flow. 2. Tested to EIA/JESD22-A114-A. 3. Tested to EIA/JESD22-A115-A. 4. Tested to JESD22-C101-A. 5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol VCC VIN VIO VIS TA tr, tf Positive DC Supply Voltage Digital Input Voltage (Select and Inhibit) Static or Dynamic Voltage Across an Off Switch Analog Input Voltage (CH, COM) Operating Temperature Range, All Package Types Input Rise or Fall Time, (Enable Input) NORMALIZED FAILURE RATE Vcc = 3.3 V 0.3 V Vcc = 5.0 V 0.5 V Characteristics Min 2.0 GND GND GND -55 0 0 Max 5.5 5.5 VCC VCC +125 100 20 Unit V V V V C ns/V
DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES
Junction Temperature 5C 80 90 100 110 120 130 140 Time, Hours 1,032,200 419,300 178,700 79,600 37,000 17,800 8,900 Time, Years 117.8 47.9 20.4 9.4 4.2 2.0 1.0
FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 130C TJ = 120C TJ = 100C TJ = 110C TJ = 90C TJ = 80C
1 1 10 TIME, YEARS 100 1000
Figure 2. Failure Rate versus Time Junction Temperature
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NLAS1053
DC CHARACTERISTICS - Digital Section (Voltages Referenced to GND)
Guaranteed Limit Symbol VIH Parameter Minimum High-Level Input Voltage, Select and Inhibit Inputs Condition VCC 2.0 2.5 3.0 4.5 5.5 VIL Maximum Low-Level Input Voltage, Select and Inhibit Inputs 2.0 2.5 3.0 4.5 5.5 IIN Maximum Input Leakage Current, Select and Inhibit Inputs Maximum Quiescent Supply Current VIN = 5.5 V or GND 0 V to 5.5 V *55_C to 25_C 1.5 1.9 2.1 3.15 3.85 0.5 0.6 0.9 1.35 1.65 $0.1 t85_C 1.5 1.9 2.1 3.15 3.85 0.5 0.6 0.9 1.35 1.65 $1.0 t125_C 1.5 1.9 2.1 3.15 3.85 0.5 0.6 0.9 1.35 1.65 $1.0 mA V Unit V
ICC
Select and Inhibit = VCC or GND
5.5
1.0
1.0
2.0
mA
DC ELECTRICAL CHARACTERISTICS - Analog Section
Guaranteed Limit Symbol RON Parameter Maximum "ON" Resistance (Figures 17 - 23) ON Resistance Flatness (Figures 17 - 23) ON Resistance Match Between Channels CH1 or CH0 Off Leakage Current (Figure 9) COM ON Leakage Current (Figure 9) Condition VIN = VIL or VIH VIS = GND to VCC IINI 10.0 mA VIN = VIL or VIH IINI 10.0 mA VIS = 1V, 2V, 3.5V VIN = VIL or VIH IINI 10.0 mA VCH1 or VCH0 = 3.5 V VIN = VIL or VIH VCH1 or VCH0 = 1.0 VCOM 4.5 V VIN = VIL or VIH VCH1 1.0 V or 4.5 V with VCH0 floating or VCH1 1.0 V or 4.5 V with VCH1 floating VCOM = 1.0 V or 4.5 V VCC 2.5 3.0 4.5 5.5 4.5 -55 to 255C 70 40 20 16 4 < 855C 85 46 28 22 4 < 1255C 105 52 34 28 5 Unit W
RFLAT (ON) DRON (ON) ICH0 ICH1 ICOM(ON)
W
4.5
2
2
3
W
5.5 5.5
1 1
10 10
100 100
nA nA
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NLAS1053
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
Guaranteed Max Limit VCC Symbol tON Parameter Turn-On Time (Figures 12 and 13) INH to Output Turn-Off Time (Figures 12 and 13) INH to Output Transition Time (Channel Selection Time) (Figure ) Select to Output Minimum Break-Before-Make Time Break Before Make Test Conditions RL = 300 W, CL = 35 pF (Figures 4 and 5) (V) 2.5 3.0 4.5 5.5 2.5 3.0 4.5 5.5 2.5 3.0 4.5 5.5 2.5 3.0 4.5 5.5 -55 to 25_C Min 2 2 1 1 2 2 1 1 5 5 2 2 1 1 1 1 Typ* 7 5 4 3 7 5 4 3 18 13 12 9 12 11 6 5 Max 12 10 9 8 12 10 9 8 28 21 16 14 < 85_C Min 2 2 1 1 2 2 1 1 5 5 2 2 1 1 1 1 Max 15 15 12 12 15 15 12 12 30 25 20 20 < 125_C Min 2 2 1 1 2 2 1 1 5 5 2 2 1 1 1 1 Max 15 15 12 12 15 15 12 12 30 25 20 20 Unit ns
tOFF
RL = 300 W, CL = 35 pF (Figures 4 and 5)
ns
ttrans
RL = 300 W, CL = 35 pF (Figures and )
ns
tBBM
VIS = 3.0 V (Figure 3) RL = 300 W, CL = 35 pF F
ns
*Typical Characteristics are at 25_C.
Typical @ 25, VCC = 5.0 V CIN CNO or CNC CCOM C(ON) Maximum Input Capacitance, Select/INH Input Analog I/O (switch off) Common I/O (switch off) Feedthrough (switch on) 8 10 10 20 pF
ADDITIONAL APPLICATION CHARACTERISTICS (Voltages Referenced to GND Unless Noted)
VCC Symbol BW Parameter Maximum On-Channel -3dB Bandwidth or Minimum Frequency Response (Figure 10) Maximum Feedthrough On Loss Condition VIN = 0 dBm VIN centered between VCC and GND (Figure 7) VIN = 0 dBm @ 100 kHz to 50 MHz VIN centered between VCC and GND (Figure 7) f = 100 kHz VIS = 1 V RMS kHz; VIN centered between VCC and GND (Figure 7) VIN = VCC to GND, FIS = 20 kHz tr = tf = 3 ns RIS = 0 W, CL = 1000 pF Q = CL * VOUT (Figure 8) FIS = 20 Hz to 100 kHz, RL = Rgen = 600 W, CL = 50 pF VIS = 5.0 VPP sine wave V 3.0 30 45 4.5 5.5 55 3.0 4.5 5.5 3.0 4.5 5.5 3.0 5.5 Typical 25C 170 200 200 -3 3 -3 3 -3 -93 93 -93 93 -93 1.5 3.0 Unit MHz
VONL
dB
VISO
Off Channel Off-Channel Isolation (Figure 10) Charge Injection Select Input to In ut Common I/O (g ) (Figure 15)
dB
Q
pC C
THD
Total Harmonic Distortion THD + Noise (Figure 14)
5.5
0.1
%
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NLAS1053
DUT VCC 0.1 mF 300 Output VOUT 35 pF
VCC Input GND tBMM 90% Output 90% of VOH
Switch Select Pin GND
Figure 3. tBBM (Time Break-Before-Make)
DUT VCC 0.1 mF Open 300 Output VOUT 35 pF
VCC Input 0V
50%
50%
VOH 90% Output 90%
INH Input
VOL tON tOFF
Figure 4. tON/tOFF
VCC DUT Output Open 300 VOUT 35 pF
VCC Input 0V
50%
50%
VOH Output VOL tOFF 10% tON 10%
INH Input
Figure 5. tON/tOFF
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NLAS1053
VCC 0.1 mF GND Output VOUT 300 35 pF VCC Output Select Pin GND 10% 90% VCC Input 0V
50%
50%
ttrans
ttrans
Figure 6. ttrans (Channel Selection Time)
50 Reference Input Output 50 Generator 50 DUT Transmitted
Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction. VISO = Off Channel Isolation = 20 Log VONL = On Channel Loss = 20 Log VOUT VIN for VIN at 100 kHz for VIN at 100 kHz to 50 MHz
VOUT VIN
Bandwidth (BW) = the frequency 3 dB below VONL
Figure 7. Off Channel Isolation/On Channel Loss (BW)/Crosstalk (On Channel to Off Channel)/VONL
DUT Open Output VIN
VCC GND CL Output Off On Off VOUT
VIN
Figure 8. Charge Injection: (Q)
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NLAS1053
100
0 -20
Bandwidth (ON-RESPONSE)
10
LEAKAGE (nA)
1
-40 ICOM(ON) (dB)
Off Isolation
0.1
-60 ICOM(OFF) VCC = 5.0 V TA = 25_C
0.01
VCC = 5.0 V ICH(OFF)
0.001
-80
-55
-20
25
70
85
125
-100 0.01
0.1
TEMPERATURE (C)
1 10 FREQUENCY (MHz)
100 200
Figure 9. Switch Leakage versus Temperature
Figure 10. Bandwidth and Off-Channel Isolation
30
0 25 PHASE (Degree) 10 TIME (ns) 20 15 10 VCC = 5.0 V TA = 25_C 0.01 0.1 1 10 FREQUENCY (MHz) 100 200 5 0 2.5 ttrans (ns)
20
30
tON/tOFF (ns)
3
3.5
4
4.5
5
VCC (VOLTS)
Figure 11. Phase versus Frequency
Figure 12. tON and tOFF versus VCC at 255C
30 VCC = 4.5 V 25 20 TIME (ns) 15 10 5 0 -55 ttrans tON/tOFF THD + NOISE (%)
1 VINpp = 3.0 V VCC = 3.6 V
0.1 VINpp = 5.0 V VCC = 5.5 V
0.01 -40 25 Temperature (C) 85 125 1 10 FREQUENCY (kHz) 100
Figure 13. tON and tOFF versus Temp
Figure 14. Total Harmonic Distortion Plus Noise versus Frequency
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NLAS1053
3.0 2.5 2.0 Q (pC) 1.5 1.0 0.5 0 -0.5 0 1 2 VCOM (V) 3 4 5 VCC = 3 V VCC = 5 V ICC (nA) 100 10 1 0.1 0.01 0.001 0.0001 0.00001 -40 VCC = 3.0 V
VCC = 5.0 V -20 0 20 60 80 100 120
Temperature (C)
Figure 15. Charge Injection versus COM Voltage
Figure 16. ICC versus Temp, VCC = 3 V & 5 V
100 VCC = 2.0 V
100 90 80 70
80
RON ()
RON ()
60 VCC = 2.5 V VCC = 3.0 V 20 VCC = 4.5 V
60 50 40 30 20 10 -55C 0 0.5 1 1.5 2 2.5 25C 125C 85C
40
0 0 1 2 3 4 5 VCOM (VOLTS)
0 VCOM (VOLTS)
Figure 17. RON versus VCOM and VCC (@ 255C
Figure 18. RON versus VCOM and Temperature, VCC 2.0 V
70 60 50 RON () 40 30 125C 20 85C 10 0 0 0.5 1 1.5 VCOM (VOLTS) 2 2.5 3 -55C RON () 25C
40 35 30 25 20 15 85C 10 5 0 0 0.5 1 1.5 2 2.5 3 3.5 VCOM (VOLTS) -55C 25C 125C
Figure 19. RON versus VCOM and Temperature, VCC = 2.5 V http://onsemi.com
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Figure 20. RON versus VCOM and Temperature, VCC = 3.0 V
NLAS1053
20 18 16 14 RON () RON () 12 10 8 6 4 2 0 0 1 2 3 VCOM (VOLTS) 4 5 25C -55C 4 2 0 0 1 2 3 4 VCOM (VOLTS) 5 6 85C 125C 18 16 14 12 10 85C 8 -55C 6 25C 125C
Figure 21. RON versus VCOM and Temperature, VCC = 4.5 V
20
Figure 22. RON versus VCOM and Temperature, VCC = 5.0 V
15 125C RON () 10
85C
5 -55C 0 0 1 2 3 4 VCOM (VOLTS)
25C
5
6
Figure 23. RON versus VCOM and Temperature, VCC = 5.5 V
DEVICE ORDERING INFORMATION
Device Nomenclature Device Order Number NLAS1053US Circuit Indicator NL Device Function 1053 Package Suffix US Package Type US8 Tape and Reel Size 178 mm (7) 3000 Unit
Technology AS
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NLAS1053
CAVITY TAPE
TOP TAPE
TAPE TRAILER (Connected to Reel Hub) NO COMPONENTS 160 mm MIN
COMPONENTS DIRECTION OF FEED
TAPE LEADER NO COMPONENTS 400 mm MIN
Figure 24. Tape Ends for Finished Goods
TAPE DIMENSIONS mm 2.00
4.00 4.00 1.50 TYP 1.75
0.30 8.00 + 0.10 -
3.50 $ 0.25
1 1.00 0.25 TYP DIRECTION OF FEED
Figure 25. US8 Reel Configuration/Orientation
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NLAS1053
t MAX
1.5 mm MIN (0.06 in) 20.2 mm MIN (0.795 in)
13.0 mm $0.2 mm (0.512 in $0.008 in)
A
50 mm MIN (1.969 in)
FULL RADIUS
G
Figure 26. Reel Dimensions
REEL DIMENSIONS
Tape Size 8 mm T and R Suffix US A Max 178 mm (7 in) G 8.4 mm, + 1.5 mm, -0.0 (0.33 in + 0.059 in, -0.00) t Max 14.4 mm (0.56 in)
DIRECTION OF FEED
BARCODE LABEL POCKET HOLE
Figure 27. Reel Winding Direction
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NLAS1053
PACKAGE DIMENSIONS
US8 US SUFFIX CASE 493-01 ISSUE O
-X- A
8 5
-Y-
J
DETAIL E B L
1
4
R S U C
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. DIMENSION A" DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055") PER SIDE. 4. DIMENSION B" DOES NOT INCLUDE INTER-LEAD FLASH OR PROTRUSION. INTER-LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055") PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076-0. 0203 MM. (300-800 INCH). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED 0.0508 (0.0002"). MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0_ 6_ 5_ 10 _ 0.28 0.44 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0_ 6_ 5_ 10 _ 0.011 0.017 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC
P
G
-T-
SEATING PLANE
D 0.10 (0.004)
K
M
0.10 (0.004) T N TXY V
H
R 0.10 TYP
M
F DETAIL E 3.8 1.8 TYP 0.5 TYP
DIM A B C D F G H J K L M N P R S U V
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada JAPAN: ON Semiconductor, Japan Customer Focus Center 4-32-1 Nishi-Gotanda, Shinagawa-ku, Tokyo, Japan 141-0031 Phone: 81-3-5740-2700 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative.
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1.0
EEE EEE EEE EEE EEE EEE EEE
0.3 TYP (mm)
NLAS1053/D

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